![]() The required volume of cooling air can be calculated as Volume (CFM) = 3.16 x Max Heat (watts) / ΔT (F), where Max Heat is the maximum sustained power dissipation of boards and components inside the enclosure, and ΔT is the maximum allowable temperature rise.ĭesigns with air intake cutouts in the bottom panel should include feet to raise the enclosure off of its support surface. When in doubt - use a fan or fans to move air in and out of your enclosure. ![]() Unnecessary holes in the enclosure panels can cause disruption of natural convection currents, resulting in less effective cooling of the processors. To maximize the effect of ventilation airflow, ensure the only openings in your enclosure are the ventilation cutouts or openings that will be filled by switches, connectors, or panel display features. See Figure 5 below for some examples of ventilation cutout placements. ![]() You can gain better air flow across the top of the board - on its way through the enclosure if you arrange the intake and exhaust cutouts accordingly. Align intake and exhaust outlets so you can take advantage of the current they create, and make sure they don't conflict with heat sink fan flow. VENT CUTOUT PLACEMENTĬonsider the orientation of fans carefully. Note: If you intend to use a fan-cooled processor in a situation with little clearance between the fan and the enclosure wall, we recommend fans that pull air directionally across the processor heat sink rather than down onto the top of the sink. 375" (9.53mm) clearance between the inside surface of the enclosure and the board.
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